| Message ID | 20181101153642.11315-1-leif.lindholm@linaro.org |
|---|---|
| Headers | show |
| Series | fix top-level package builds for AARCH64/ARM | expand |
Hmm, I kind of dropped the ball on this set, waiting for feedback on
the reworked version of 1/6.
In the meantime, Ard submitted an identical fix for 4/6
"MdeModulePkg: drop DebugSupportDxe from AARCH64 components" which got
merged as fc27682813
("MdeModulePkg/MdeModulePkg/dsc: move DxeDebugSupportDxe to x86 only section")
Since I now have R-b for the set, I have just pushed the remaining 5
as 6c61ec4c62..3b6c73f13e.
On Thu, Nov 01, 2018 at 03:36:36PM +0000, Leif Lindholm wrote:
> Most of the top-level packages should be buildable for all architectures
> Here is a fairly trivial set that makes that happen.
>
> Leif Lindholm (6):
> AppPkg: fix webserver build for !Ia32/X64
> IntelFrameworkModulePkg: fix build for AARCH64/ARM
> IntelFrameworkPkg: fix build for AARCH64/ARM
> MdeModulePkg: drop DebugSupportDxe from AARCH64 components
> SecurityPkg: fix package build on ARM
> SignedCapsulePkg: enable package build for AARCH64/ARM
>
> Cc: Daryl McDaniel <edk2-lists@mc2research.org>
> Cc: Jaben Carsey <jaben.carsey@intel.com>
> Cc: Liming Gao <liming.gao@intel.com>
> Cc: Michael D Kinney <michael.d.kinney@intel.com>
> Cc: Liming Gao <liming.gao@intel.com>
> Cc: Star Zeng <star.zeng@intel.com>
> Cc: Jian J Wang <jian.j.wang@intel.com>
> Cc: Chao Zhang <chao.b.zhang@intel.com>
> Cc: Jiewen Yao <jiewen.yao@intel.com>
>
> IntelFrameworkModulePkg/IntelFrameworkModulePkg.dsc | 13 ++++++++++++-
> IntelFrameworkPkg/IntelFrameworkPkg.dsc | 2 +-
> MdeModulePkg/MdeModulePkg.dsc | 2 +-
> SecurityPkg/SecurityPkg.dsc | 11 +++++++++++
> SignedCapsulePkg/SignedCapsulePkg.dsc | 15 ++++++++++++++-
> AppPkg/Applications/Sockets/WebServer/WebServer.h | 2 ++
> 6 files changed, 41 insertions(+), 4 deletions(-)
>
> --
> 2.11.0
>
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