@@ -124,6 +124,11 @@ cpu_b0: cpu@100 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
cpu_b1: cpu@101 {
@@ -136,6 +141,11 @@ cpu_b1: cpu@101 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
idle-states {
The thermal framework accepts now the cpu idle cooling device as an alternative when the cpufreq cooling device fails. Add the node in the DT so the cooling devices will be present and the platforms can extend the thermal zone definition to add them. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> --- arch/arm64/boot/dts/rockchip/rk3399.dtsi | 10 ++++++++++ 1 file changed, 10 insertions(+) -- 2.25.1