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[RFC,v3,3/5] thermal: Add interface to cooling devices to handle governor change

Message ID 20220406220809.22555-4-lukasz.luba@arm.com
State New
Headers show
Series Introduce Cpufreq Active Stats | expand

Commit Message

Lukasz Luba April 6, 2022, 10:08 p.m. UTC
Add interface to cooling devices to handle governor change, to better
setup internal needed structures or to cleanup them. This interface is
going to be used by thermal governor Intelligent Power Allocation (IPA).
which requires to setup monitoring mechanism in the cpufreq cooling
devices.

Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
---
 include/linux/thermal.h | 1 +
 1 file changed, 1 insertion(+)
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Patch

diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index c314893970b3..baaa84d989bd 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -87,6 +87,7 @@  struct thermal_cooling_device_ops {
 	int (*get_requested_power)(struct thermal_cooling_device *, u32 *);
 	int (*state2power)(struct thermal_cooling_device *, unsigned long, u32 *);
 	int (*power2state)(struct thermal_cooling_device *, u32, unsigned long *);
+	int (*change_governor)(struct thermal_cooling_device *cdev, bool set);
 };
 
 struct thermal_cooling_device {