Message ID | 20230226225406.979703-1-daniel.lezcano@linaro.org |
---|---|
Headers | show |
Series | Self-encapsulate the thermal zone device structure | expand |
On 2/27/23 07:53, Daniel Lezcano wrote: > The thermal zone device structure is exposed to the different drivers > and obviously they access the internals while that should be > restricted to the core thermal code. > > In order to self-encapsulate the thermal core code, we need to prevent > the drivers accessing directly the thermal zone structure and provide > accessor functions to deal with. > > Use the devdata accessor introduced in the previous patch. > > No functional changes intended. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> > Acked-by: Mark Brown <broonie@kernel.org> > Reviewed-by: Ido Schimmel <idosch@nvidia.com> #mlxsw > Acked-by: Gregory Greenman <gregory.greenman@intel.com> #iwlwifi > Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com> #power_supply > Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> For the ahci change: Acked-by: Damien Le Moal <damien.lemoal@opensource.wdc.com>