@@ -46,6 +46,19 @@ struct thermal_attr {
char name[THERMAL_NAME_LENGTH];
};
+static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
+{
+ return cdev->ops->get_requested_power && cdev->ops->state2power &&
+ cdev->ops->power2state;
+}
+
+int power_actor_get_max_power(struct thermal_cooling_device *cdev,
+ struct thermal_zone_device *tz, u32 *max_power);
+int power_actor_get_min_power(struct thermal_cooling_device *cdev,
+ struct thermal_zone_device *tz, u32 *min_power);
+int power_actor_set_power(struct thermal_cooling_device *cdev,
+ struct thermal_instance *ti, u32 power);
+
/*
* This structure is used to describe the behavior of
* a certain cooling device on a certain trip point
@@ -400,18 +400,6 @@ void devm_thermal_zone_of_sensor_unregister(struct device *dev,
#endif
#if IS_ENABLED(CONFIG_THERMAL)
-static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
-{
- return cdev->ops->get_requested_power && cdev->ops->state2power &&
- cdev->ops->power2state;
-}
-
-int power_actor_get_max_power(struct thermal_cooling_device *,
- struct thermal_zone_device *tz, u32 *max_power);
-int power_actor_get_min_power(struct thermal_cooling_device *,
- struct thermal_zone_device *tz, u32 *min_power);
-int power_actor_set_power(struct thermal_cooling_device *,
- struct thermal_instance *, u32);
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
void *, struct thermal_zone_device_ops *,
struct thermal_zone_params *, int, int);
@@ -449,18 +437,6 @@ struct thermal_instance *get_thermal_instance(struct thermal_zone_device *,
void thermal_cdev_update(struct thermal_cooling_device *);
void thermal_notify_framework(struct thermal_zone_device *, int);
#else
-static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
-{ return false; }
-static inline int power_actor_get_max_power(struct thermal_cooling_device *cdev,
- struct thermal_zone_device *tz, u32 *max_power)
-{ return 0; }
-static inline int power_actor_get_min_power(struct thermal_cooling_device *cdev,
- struct thermal_zone_device *tz,
- u32 *min_power)
-{ return -ENODEV; }
-static inline int power_actor_set_power(struct thermal_cooling_device *cdev,
- struct thermal_instance *tz, u32 power)
-{ return 0; }
static inline struct thermal_zone_device *thermal_zone_device_register(
const char *type, int trips, int mask, void *devdata,
struct thermal_zone_device_ops *ops,
The exported IPA functions are used by the IPA. It is pointless to declare the functions in the thermal.h file. For better self-encapsulation and less impact for the compilation if a change is made on it. Move the code in the thermal core internal header file. As the users depends on THERMAL then it is pointless to have the stub, remove them. Take also the opportunity to fix checkpatch warnings/errors when moving the code around. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> --- drivers/thermal/thermal_core.h | 13 +++++++++++++ include/linux/thermal.h | 24 ------------------------ 2 files changed, 13 insertions(+), 24 deletions(-) -- 2.17.1